A major obstacle may be standing in the way of the next generation of ultra-tiny computer chips. Researchers discovered that many promising 2D materials lose their advantages because an invisible atomic-scale gap forms when they are combined with insulating layers. That tiny gap weakens electronic performance and could prevent further miniaturization. The team says new “zipper materials” that lock together more tightly may offer a path forward.
source https://www.sciencedaily.com/releases/2026/05/260508003125.htm
JDownloader site hacked to replace installers with Python RAT malware
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The website for the popular JDownloader download manager was compromised
earlier this week to distribute malicious Windows and Linux installers,
with the W...
16 hours ago
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